Transparent material processing with an ultrashort pulse laser

ABSTRACT

A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques.

CROSS-REFERENCE TO RELATED APPLICATION

This is a divisional of application Ser. No. 13/766,357, filed Feb. 13,2013, which is a continuation of application Ser. No. 12/580,739, filedOct. 16, 2009, now issued as U.S. Pat. No. 8,389,891 on Mar. 5, 2013which is a divisional of application Ser. No. 11/517,325 filed Sep. 8,2006 now issued as U.S. Pat. No. 7,626,138 on Dec. 1, 2009, which claimsbenefit of Provisional Application No. 60/714,863 filed Sep. 8, 2005.The above-noted applications are incorporated herein by reference intheir entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates to ultrashort pulse laser processing of opticallytransparent materials, including material scribing, welding and marking.

2. Description of the Related Art

A. Cutting and Scribing

Cutting of optically transparent materials is often done with mechanicalmethods. Perhaps the most common method for cutting thin, flat materialsis using a mechanical dicing saw. This is the standard method in themicroelectronics industry for dicing silicon wafers. However, thismethod generates significant debris that must be managed in order toavoid parts contamination, resulting in increased overall cost of theprocess. In addition, the thinner wafers being used for advancedmicroprocessor designs tend to shatter when cut with a dicing saw.

To address these problems, current state-of-the-art processes for“scribe and cleave” material cutting use various types of lasers toscribe a surface groove on the material prior to breaking the materialalong this scribe. For example, a sub-picosecond laser pulses have beenused to cut silicon and other semiconductor materials (H. Sawada,“Substrate cutting method,” U.S. Pat. No. 6,770,544). Also, a focusedastigmatic laser beam has been used to make a single surface groove formaterial cutting (J. P. Sercel, “System and method for cutting using avariable astigmatic focal beam spot,” U.S. Patent Application No.20040228004). This patent claims that by optimizing the astigmaticfocusing geometry, increased processing speeds can be achieved.

To achieve a precise, high quality cleave, the groove must be of acertain minimum depth, the value of which varies by application (forexample, 100-μm thick sapphire requires an approximately 15-μm deepgroove for acceptable cleaving). Because the depth of the groovedecreases as the scanning speed increases, the minimum depth requirementlimits the maximum scanning speed, and hence the overall throughput, ofa laser-scribing system. Alternative technology for material cuttinguses multiphoton absorption to form a single laser-modified line featurewithin the bulk of a transparent target material (F. Fukuyo et al.,“Laser processing method and laser processing apparatus,” U.S. PatentApplication No. 20050173387). As in the case of a surface groove, thereis a particular minimum size of this sub-surface feature that isrequired in order to yield precise, high quality cleaving of thematerial, which equates to a limit on the processing speed for materialcutting.

A noteworthy application of “scribe and cleave” material cutting iswafer dicing for separation of individual electronic and/oroptoelectronic devices. For example, sapphire wafer dicing is used insingulation of blue light emitting diodes. Wafer singulation can beaccomplished with backside laser ablation, minimizing contamination ofdevices on the front side of the wafer (T. P. Glenn et al., “Method ofsingulation using laser cutting,” U.S. Pat. No. 6,399,463). Also, anassist gas can be used to aid a laser beam that dices a substrate (K.Imoto et al., “Method and apparatus for dicing a substrate,” U.S. Pat.No. 5,916,460). In addition, a wafer can be diced by first using a laserto scribe a surface groove, and then using a mechanical saw blade tocomplete the cutting (N. C. Peng et al., “Wafer dicing device andmethod,” U.S. Pat. No. 6,737,606). Such applications are generallyexecuted in large volume and hence processing speed is of particularimportance.

One process uses two different types of lasers, one of which scribes thematerial, and the other of which breaks the material (J. J. Xuan et al.,“Combined laser-scribing and laser-breaking for shaping of brittlesubstrates,” U.S. Pat. No. 6,744,009). A similar process uses a firstlaser beam to generate a surface scribe line, and a second laser beam tocrack a non-metallic material into separate pieces (D. Choo et al.,“Method and apparatus for cutting a non-metallic substrate using a laserbeam,” U.S. Pat. No. 6,653,210). Two different laser beams for scribingand cracking have also been used to cut a glass plate (K. You,“Apparatus for cutting glass plate,” International Patent ApplicationNo. WO 2004083133). Finally, a single laser beam has been used to scribeand crack a material by focusing the laser beam near the top surface ofthe material and moving the focus down through the material to near thebottom surface while providing relative lateral motion between thefocused laser beam and the target material (J. J. Xuan et al., “Methodfor laser-scribing brittle substrates and apparatus therefor,” U.S. Pat.No. 6,787,732).

B. Material Joining

The joining of two or more optically transparent materials, such asglasses and plastics, is useful for applications in various industries.The construction of any type of device in which optical transparencyallows or supplements functionality, or otherwise results in additionalvalue (e.g. aesthetic), could benefit from such a joining process. Oneexample is hermetic sealing of components where visual inspection isneeded (e.g. telecommunications and biomedical industries).

In some applications, conventional joining processes (e.g. adhesives,mechanical joining) are inadequate. For example, many adhesives mightprove non-biocompatible in the case of biomedical implant devices. Forother devices, the adhesion simply may not be strong enough for theparticular application (e.g. high-pressure seals). For such demands,laser welding offers an ideal solution.

In microfluidic systems, the sealing of individual, closely spaced pathsrelative to each other with a cap piece that covers the entire devicewould be desirable. Strong, tightly sealing joints can be difficult tomake with other methods due to the small contact region between thedifferent microfluidic paths. Laser welding can precisely position thebonded regions between these microfluidic paths and provide a tightseal.

The current state-of-the-art technology for laser welding of transparentmaterials consists of:

(1) use of a CO₂ laser, the wavelength (˜10 μm) of which is linearlyabsorbed by many optically-transparent materials, or

(2) introduction of an additional material at the interface of thetransparent materials, which is specially designed to absorb the laserradiation, thereby causing heating, melting, and fusing of thematerials.

Both of these methods are limited in their functionality and/or costlyin their implementation.

A pulsed CO₂ slab laser has been used to weld Pyrex to Pyrex, and tobond polyimide and polyurethane to titanium and stainless steel (H. J.Herfurth et al., “Joining Challenges in the Packaging of BioMEMS,”Proceedings of ICALEO 2004). Also, fused quartz and other refractorymaterials have been welded with a 10.6 μm CO₂ laser (M. S. Piltch etal., “Laser welding of fused quartz,” U.S. Pat. No. 6,576,863). The useof such CO₂ lasers does not allow welding by focusing the beam through athick top layer material, since the laser radiation is absorbed beforeit can reach the interface. An additional disadvantage is that the largewavelength does not allow focusing the beam to a small spot, therebylimiting its usefulness for creating small weld features on micronscales.

Alternatively an absorbing layer that is transparent to the human eyecan be placed between two materials to be welded, such as polyamide andacrylic (V. A. Kagan et al., “Advantages of Clearweld Technology forPolyamides,” Proceedings ICALEO 2002). A diode laser with line focusingis then used for welding (T. Klotzbuecher et al., “Microclear—A NovelMethod for Diode Laser Welding of Transparent Micro Structured PolymerChips,” Proceedings of ICALEO 2004). The dye layer is specially designedto absorb the laser's wavelength (R. A. Sallavanti et al., “Visiblytransparent dyes for through-transmission laser welding,” U.S. Pat. No.6,656,315).

One welding process for bonding glass to glass or metal employs a laserbeam to melt a glass solder between the surfaces to be welded (M.Klockhaus et al., “Method for welding the surfaces of materials,” U.S.Pat. No. 6,501,044). Also, two fibers can be welded together by using anintermediary layer that is linearly absorbent to the laser wavelength(M. K. Goldstein, “Photon welding optical fiber with ultra violet (UV)and visible source,” U.S. Pat. No. 6,663,297). Similarly, a fiber with aplastic jacket can be laser-welded to a plastic ferrule by inserting anabsorbing intermediary layer (K. M. Pregitzer, “Method of attaching afiber optic connector,” U.S. Pat. No. 6,804,439).

The use of an additional layer of an absorbing material has significantdrawbacks. The most obvious is the cost of purchasing or fabricating amaterial that is appropriate for the process. A potentially more costlyissue is the increase in processing time associated with incorporatingthis additional material into the manufacturing process. Such costswould be expected to rise dramatically as the size of the desired weldregion becomes increasingly small, as would be the case with biomedicalimplant devices. Another disadvantage of using an intermediate,light-absorbing layer is that this layer may introduce contaminants intothe area to be sealed. In the case of a microfluidic system, thelight-absorbing layer would be in direct contact with the fluid flowingthrough the channel.

One method for welding a transparent material to an absorbing materialis called through-transmission welding. In this method a laser beam isfocused through a transparent material and onto an absorbing material,resulting in welding of the two materials (W. P. Barnes, “Low expansionlaser welding arrangement,” U.S. Pat. No. 4,424,435). This method hasbeen used to weld plastics by directing polychromatic radiation througha top transparent layer and focusing the radiation onto a bottomabsorbing layer (R. A. Grimm, “Plastic joining method,” U.S. Pat. No.5,840,147; R. A. Grimm, “Joining method,” U.S. Pat. No. 5,843,265). Inanother example of this method, a black molded material that istransparent to the laser wavelength is welded to an adjacent material orvia an added welding assist material that absorbs the laser wavelength(F. Reil, “Thermoplastic molding composition and its use for laserwelding,” U.S. Pat. No. 6,759,458). Similarly, another method uses atleast two diode lasers in conjunction with a projection mask to weld twomaterials, at least one of which is absorbent of the laser wavelength(J. Chen et al., “Method and a device for heating at least two elementsby means of laser beams of high energy density,” U.S. Pat. No.6,417,481).

Another laser welding method performs successive scans of a laser beamover the interface between two materials to incrementally heat thematerials until melting and welding occurs (J. Korte, “Method andapparatus for welding,” U.S. Pat. No. 6,444,946). In this patent onematerial is transparent, while the other material is absorbent to thelaser wavelength. Finally, one method uses ultraviolet, laser, X-ray,and synchrotron radiation to melt two pieces of material, and thenbrings them into contact in order to form a weld (A. Neyer et al.,“Method for linking two plastic work pieces without using foreignmatter,” U.S. Pat. No. 6,838,156).

Laser welding is disclosed for hermetic sealing of organic lightemitting diodes where there is at least one layer of organic materialbetween two substrates (“Method of fabrication of hermitically sealedglass package”, U.S. Patent Application Publication 20050199599).

Tamaki et al. discuss the use of 130-fs laser pulses at 1 kHz to bondtransparent material in “Welding of Transparent Materials UsingFemtosecond Laser Pulses”, Japanese Journal of Applied Physics, Vol. 44,No. 22, 2005. However, the material interaction of low repetition rateultrashort pulses (kHz) is known to be distinctly different compared tohigh repetition rate ultrashort pulses (MHz) due to electron-phononcoupling time constants and accumulation effects.

C. Sub-Surface Marking

The patterning of sub-surface marks in glass has been adapted by artiststo create 2-D portraits and 3-D sculptural works. These marks aredesigned to be strongly visible under a wide range of conditions withoutrequiring external illumination.

Tightly focusing energy below the surface of optically transparentmaterials can produce visible, radially propagating micro-cracks.Long-pulse lasers are commonly used to create these marks. Severalpatents discuss variation of the size and density of these radial cracksto control the visibility of the subsequent pattern (U.S. Pat. Nos.6,333,486, 6,734,389, 6,509,548, 7,060,933).

The visibility of the mark can be controlled by the crack density aroundthe central laser spot, rather than just the size of the mark (U.S. Pat.No. 6,417,485, “Method and laser system controlling breakdown processdevelopment and space structure of laser radiation for production ofhigh quality laser-induced damage images”).

U.S. Pat. No. 6,426,480 (“Method and laser system for production of highquality single-layer laser-induced damage portraits inside transparentmaterial”) uses a single layer of smooth marks where brightness iscontrolled by the spot density.

Increasing the pulse duration of the writing laser light will increasethe brightness of the mark (U.S. Pat. No. 6,720,521, “A method forgenerating an area of laser-induced damage inside a transparent materialby controlling a special structure of a laser irradiation”).

SUMMARY OF THE INVENTION

Through nonlinear absorption, ultrashort laser pulses can deposit energyinto an extremely well-defined region within the bulk of a transparentmaterial. Matching the laser properties and processing conditions canproduce a range of features, changes in the index of refraction thatenable optical waveguiding, melting and subsequent bonding at aninternal interface, or the formation of an optical defect that scatterslight.

The high repetition rate of the laser and significant pulse-to-pulseoverlap results in an additional interaction between the materialmodification created by the previous laser exposure and the subsequentpulses in the same region. The light diffracts around the pre-existingmodification and, through constructive interference, creates anotherspot in the “shadow” of the previous modification, commonly known as the“spot of Arago” or the “Poisson spot”. The size and intensity of thespot increases with distance, with the intensity asymptoticallyapproaching the input laser intensity.

One object of this invention is to enable clean breaking of transparentmaterials at a higher speed compared to the conventional technique. Thisis achieved by using ultrashort laser pulses to create both a surfacegroove on the material and one or more laser-modified regions within thebulk of the material (or, alternatively, multiple sub-surfacelaser-modified features only), with only a single pass of the beamacross the material. Because multiple scribe features are createdsimultaneously, located both on the surface and in the bulk of thematerial, or in the bulk of the material only, the success of thesubsequent cleave is not necessarily dependent on surface groove depth.

During the cleaving process of a scribed material, the fracture beginsat the surface scribe feature and propagates down through the material.If the surface groove is too shallow, the fracture will tend to wander,resulting in low quality cleave facets and poor cleave processprecision. With the presence of additional scribe feature(s) within thebulk of the material, however, the fracture is guided through thematerial in the desired direction, resulting in higher cleavingprecision and facet quality than would be expected for the case of ashallow surface scribe only.

If a sufficient portion of the bulk material is modified below thesurface, the fracture can begin from a sub-surface modified region andpropagate to adjacent modified regions through the bulk of the material,without the need of a surface scribe line. Minimizing the size of, orcompletely eliminating, the surface groove also reduces the debrisproduced by the process that can contaminate the processing environmentor require more extensive post-process cleaning.

Another object of this invention is the generation of patterns ofsub-surface defects in transparent materials by focusing ultrashortlaser pulses below the surface. Slightly modifying the processingconditions relative to scribing can produce optical defects below thesurface that scatter light. By controlling the characteristics andarrangement of these defects, these patterns can be made to be clearlyvisible when illuminated from the side, but difficult to see when thereis no illumination. This feature of sub-surface marking can be utilizedfor indicator signs or lights for vehicles, warning signs or lights, orfor adding value (e.g., artistically) to a simple glass, etc. Thistechnique is distinct from known laser marking techniques which aredesigned in a way such that the defects produced in the material arealways clearly visible.

In one embodiment of this invention, a pattern of optical defects arecreated at different depths within the transparent material. Having themarks at different depths prevents a “shadowing” effect where one markblocks the illuminating light from hitting subsequent marks. Thisstructure at the same time reduces the amount of scattering from ambientillumination sources which are not directional, enhancing the contrastbetween the on-off states. These defects can be discrete points orextended lines.

The small size and smoother profile of these defects makes them lessvisible when not illuminated. Also the substrate will be stronger andless susceptible to crack propagation due to thermal or mechanicalstress, particularly with thin transparent materials. The small sizealso allows for more discrete writing positions per unit thickness,increasing the pattern resolution for a given thickness of transparentmaterial.

There is a trade-off between the visibility of the mark when illuminatedand the invisibility of the marks without illumination. This trade-offcan be adjusted by controlling the illuminating light source intensity,the size and smoothness of the marks and the spacing between marks. Thecontrol parameters for the size of the marks include pulse duration,fluence, and repetition rate and wavelength of the laser, and depth andmovement speed of the focus point within the material. It is importantto note that these parameters need to be adjusted for transparentmaterials with different optical, thermal and mechanical properties.

The desired pattern can be made up of a collection of discrete pixelswhere each pixel is a collection of parallel lines. Utilizing pixelsenables creation of an over-all larger icon with fewer lines withgreater contrast in visibilities.

The sub-surface pattern can be illuminated by a properly focused lightsource. Focusing is important to efficiently illuminate the pattern andminimize stray light. This illuminating light can be delivered directlyfrom the light source if the distance between the light source and thepattern is relatively short. If the distance is long, total internalreflection between the top and bottom surfaces of the transparentmaterial can be used to guide the light.

Another alternative is to create optical waveguides in the transparentmaterial to deliver the light. An advantage of optical waveguidedelivery is that the path between the source and the pattern need not bestraight and/or short. For optical waveguide delivery, the output end ofthe waveguide should be properly designed to illuminate the desiredpattern.

Two patterns in the same region can be distinguished separately andcontrollably illuminated by two different light sources. The axis of theillumination source for the respective pattern is perpendicular to themarks which make up the pattern. In this way the maximum scattering (andmaximum visibility) from a particular illumination source can beselected for only the designated pattern.

Another object of this invention is to enable bonding of two pieces ofclear material using a high repetition rate femtosecond pulse laser withno supplemental bonding agent. Focusing a high repetition rate,ultrafast laser beam at the contact area of two transparent materialpieces will create a bond by localized heating. The required repetitionrate for sufficient heat accumulation depends on many different processvariables, including pulse energy, beam focusing geometry, and thephysical properties of the particular material(s) to be welded. Atheoretical analysis of conditions affecting the femtosecond laser spotbonding process emphasizes the determination of optimal focusingconditions for the process (M. Sarkar et al., “Theoretical Analysis ofFocusing and Intensity Mechanisms for a Spot Bonding Process UsingFemtosecond Laser,” IMECE2003-41906; 2003 ASME International MechanicalEngineering Congress, November 2003, Washington, D.C., USA).

Due to nonlinear absorption of the laser radiation (caused by theultrashort pulse duration), and the pulse-to-pulse accumulation of heatwithin the materials (caused by the high repetition rate), welding oftransparent materials can be achieved with a degree of simplicity,flexibility, and effectiveness that is unparalleled in existingalternative methods. The nonlinear absorption process allows forconcentration of the absorbed energy near the weld interface, whichminimizes damage, and therefore optical distortion, to the rest of thematerial. Fine weld lines are possible when dense channels need to beseparated.

Further, an embodiment of the current invention enables the joining bylaser of two materials that are transparent to the wavelength of thelaser radiation by directing the focal region of a beam ofhigh-repetition rate, ultrashort pulses near to the interface of thematerials to be joined. The laser pulse repetition rate is between about10 kHz and 50 MHz and the laser pulse duration is between about 50 fsand 500 ps. The laser pulse energy and beam focusing optics are chosenso as to generate an energy fluence (energy per unit area) of more thanabout 0.01 J/cm² at the region to be welded.

The optimal range of fluence for welding depends on the particularmaterials to be welded. For transparent polymers (polycarbonate, PMMA(polymethylmethacrylate), etc.), the required fluence is less than thatfor glasses. This is due to the widely different physical properties ofthe materials. For example, the melting temperature of PMMA is ˜150degrees Celsius, while that for fused silica is ˜1585 degrees Celsius.Therefore, significantly more laser fluence is required to melt fusedsilica. Other important material properties include the heat capacityand the thermal conductivity. The range of fluence for welding ofpolymers is between about 0.01 and 10.0 J/cm², while the correspondingrange for welding glasses is between about 1.0 and 100 J/cm².

In general, welding requires that the two surfaces to be joined havevirtually no gap between them. An object of this invention is theformation of a raised ridge at the interface between the two pieces tobe bonded, that bridges any gap between them. By focusing highrepetition rate fs pulses slightly below the surface, heating, melting,and pressure can result in localized raising of the surface of theglass. These bumps are 10's of nm to a few μm high. Where the energydeposited is not sufficient to cause the raised ridge to bond to themating piece, a second pass of the laser at a slightly higher focusposition will then weld the ridge to the mating piece. If a single ridgeis not tall enough to bridge the gap, a second ridge on the upper matingsurface can be created.

In addition, welding of materials with varying degrees of linearabsorption can be achieved with this invention. While this inventionuses nonlinear absorption phenomena as the primary means to coupleenergy to the material, it is appreciated that materials exhibiting someamount of linear absorption of the irradiating laser pulses can also bewelded using methods presented herein. The significant aspect of linearabsorption as it relates to this invention is that for higher linearabsorption, the thickness of the material through which the beam can befocused decreases. Furthermore, higher linear absorption decreases thedegree of localization of the weld feature.

The spatial distribution of the laser fluence can also affect the weldquality. While typical laser processing involves focusing a Gaussianlaser beam to produce a smaller Gaussian laser beam, novel beam-shapingmethods may be used in order to improve upon the quality and/orefficiency of a particular welding process. For example, transformingthe typical Gaussian fluence distribution into a spatially uniformfluence distribution (known as a “flat-top” or “top-hat” intensitydistribution) may result in more uniform weld features.

The ultrashort nature of the pulses allows for coupling of the laserenergy into the transparent material via nonlinear absorption processes;however, this alone does not allow for laser welding, as this processdoes not generally result in heating of the material. It is theadditional aspect of a high pulse repetition rate, combined with aparticular range of other processing conditions, that allows foraccumulation of heat within the materials so that melting, andsubsequent cooling and joining, of the materials can be achieved.

Due to the absence of a supplemental bonding agent, processing time andexpense are reduced, contamination inside the device due to excessbonding agent is eliminated, and fine dimensional tolerances can bemaintained. Bond points and lines can be very close to other featureswithout causing any interference. Also, very limited thermal distortionof material adjacent to the weld area is possible due to theconcentrated fluence at the focal volume and the nonlinear absorptionprocess.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be more clearly understood from the followingdescription in conjunction with the accompanying drawings, wherein:

FIG. 1 is a diagram of a system used in a method for scribingtransparent materials according to one embodiment of the currentinvention, where (a) shows the system configuration, and (b) shows adetail view of the scribing and subsequent cleaving;

FIG. 2 is an illustration of the surface and bulk scribe features thatare generated by a focused Gaussian beam according to one embodiment ofthe current invention;

FIG. 3 is a diagram of a system that uses an axicon lens to generatemultiple sub-surface scribe lines according to one embodiment of thecurrent invention;

FIG. 4 is an intensity contour plot of a focused Gaussian astigmaticbeam used in one embodiment of the current invention;

FIG. 5 is an illustration of a diffractive optical element (DOE) used inone embodiment of the current invention;

FIG. 6 is a diagram of a system used in a method for welding transparentmaterials according to one embodiment of the current invention, where(a) shows the system schematic, and (b) is an enlarged view showing thedetail of beam focusing within the adjoining materials;

FIG. 7 is an illustration of the welding process where a raised ridge isused to fill the gap between two pieces. (a) shows the gap, (b) showsthe ridge formed by focusing the laser beam slightly below the surfaceof the lower piece, and (c) show the weld formed when the laser focus ismoved up to the interface between the raised ridge and the upper pieceto be bonded.

FIGS. 8-10 show illustrations of the sub-surface marking, wherein anarrow mark has been used as an example of the markings possibleaccording to the invention.

FIG. 11 is an optical micrograph showing experimental results of oneembodiment of the current invention;

FIG. 12 is an image sequence showing a fused silica weld according toone embodiment of the current invention. (a) shows the fused silicabefore breaking apart the weld, (b) shows the bottom surface of thefused silica after breaking apart the weld, and (c) shows the topsurface of the fused silica after breaking apart the weld.

FIGS. 13-15 are photos of a glass marked sample made according to thepresent invention; and.

FIGS. 16a and 16b are photos of a prior art decorative article made bylaser marking using a long-pulse laser, and an individual mark thereof.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

1. Ultrashort Pulse Laser Scribing

FIG. 1 illustrates one embodiment of the current invention, which is amethod for scribing transparent materials for subsequent cleaving. Thisembodiment employs a laser system (1) producing a beam of ultrashortlaser pulses (2), an optical system (6) that generates a desired laserbeam intensity distribution, and a target material (7) to be scribedthat is transparent to the wavelength of the laser pulses. In addition,a Z-axis stage (8) is used for beam focus position control (depth), andan automated X-Y axis stage assembly (9) is generally required formoving the work pieces (7) laterally relative to the focused laser beam.Alternatively, the laser beam (2) could be moved relative to astationary target material with the use of scanning mirrors (3), (4),and (5).

The laser beam (2) is directed through the optical system (6), whichtransforms the laser beam (2) to create a desired 3-dimensionalintensity distribution. Particular regions of the transformed laser beamhave sufficient intensity to cause ablation and/or modification of thetarget material via nonlinear absorption processes. Material ablationgenerally refers to the vaporization of material from intense laserradiation. Material modification more broadly refers to a change in thephysical and/or chemical structure of the irradiated material, which canaffect the propagation of a crack through the material. Lasermodification generally requires lower optical intensities than laserablation for a particular material.

The transformed beam is directed toward the target transparent material(7) to cause ablation/modification of the material (7) at multipledetermined locations, within and/or on the surface, of the material (7).The ablated and/or modified regions are generally located in thematerial (7) along the optical propagation axis and are separated withinthe material (7) by a determined distance. The transformed beam and thetarget material (7) are moved relative to each other, resulting in thesimultaneous generation of multiple laser-scribe features in thematerial (7). The multiple scribe features allow for cleaving of thematerial (7) with the application of suitable force(s) (See FIG. 1(b)).

FIG. 2 illustrates another embodiment of the current invention, in whicha laser beam (10) having a Gaussian spatial intensity distribution isfocused to create sufficient intensity for nonlinear absorption andsubsequent ablation or modification of the target material (11). Theregion of tightest focus is positioned below the material's surface to achosen location within the bulk of the material (11). In addition, byemploying suitable focusing optics and laser pulse energy, a region ofintensity sufficient to cause material ablation is at the same timegenerated on or near the surface of the material (11).

The important aspect is that the pulse energy and focusing geometry arechosen such that there is sufficient intensity to simultaneously causeablation or modification not only within the bulk of the material (wherethe focused beam waist is positioned), but also at another point on theoptical propagation axis prior to the beam waist (12) (either in thebulk or on the surface of the material). When the laser pulses encounterthe target material (11), their high-intensity region (near the centerof the radial Gaussian intensity distribution) is absorbed nonlinearlyby the material and ablation or modification occurs. The outer spatialregions of the laser beam (outer edges of the Gaussian intensitydistribution), however, are too low in intensity to be absorbed by thematerial, and continue to propagate to the beam waist, located furtherwithin the bulk of the material. At the beam waist location, the beamdiameter is small enough to once again generate sufficient intensity fornonlinear absorption and subsequent laser modification to occur in thebulk of the material.

A region directly below the surface ablation may also be modified bydiffraction and constructive interference of succeeding pulses after theinitial surface feature is created (spot of Arago). A relatively highrepetition rate laser source better enables this process at reasonabletranslation speeds.

Under these focusing and pulse energy conditions, translation of thematerial (11) relative to the laser beam (10) results in thesimultaneous generation of multiple laser-modified regions (i.e. asurface groove (13) and one or more bulk modified regions (14), or twoor more bulk modified regions), which together allow for precisecleaving of the material.

FIG. 3 illustrates another embodiment of the current invention, in whichan axicon (cone-shaped) lens (20) is used to generate the multipleinternal scribe lines (21). When illuminated with a laser beam (22), theaxicon lens (20) creates what is known as a 0th-order Bessel beam. Thename arises from the fact that the mathematical description of theoptical intensity distribution in the plane normal to the axis ofpropagation is defined by the 0th-order Bessel function, with the radialposition from the beam center being the independent variable. This beamhas the unique property of containing a high-intensity central beam spot(23) that can propagate with the same small size for much largerdistances than for the case of a similarly-sized beam spot generated byconventional focusing methods (i.e. much longer than the Rayleigh rangeof a conventionally-focused beam). The central intensity field issurrounded by a plurality of concentric rings of light (not shown), theintensity of which decreases with increasing radius. Due to an inwardradial component of their propagation vector, these rings of lightcontinually reconstruct the small, central beam spot (25) as the Besselbeam propagates. Therefore, a small, high intensity central beam spot(23) can be generated that maintains its small diameter through theentire thickness of a target material (24). Because of the extendedrange of tight beam focusing, the Bessel beam is also commonly referredto as a non-diffracting beam.

Because the outer rings reconstruct the intense center spot (23), if thecenter spot (23) is intense enough to cause ablation of the material atthe surface (26), the rings (which have a larger diameter than theablated region) will converge to the center of the beam a short distancelater, causing reconstruction of the intense center beam spot, at whichpoint ablation or material modification can occur again. With properoptical system design and sufficient pulse energy, this process ofablation and subsequent beam reconstruction can repeat through theentire bulk of the transparent material (24). Other optical components,such as graded-index lenses and diffractive optical elements, can alsobe used to generate Bessel beams.

In additional embodiments of this invention, alternative beam intensitytransforming techniques, well known to those skilled in the art, areemployed in the optical system of the invention to tailor the beamintensity to generate multiple scribe lines in the target material. Onesuch method utilizes astigmatic beam focusing to create two distinctregions of high optical intensity, separated by a determined distance.FIG. 4 displays an intensity distribution plot of a focused astigmaticGaussian beam, in which the focal planes of the X and Y axes areseparated by a distance of 20 μm. Note the presence of two distinct highintensity regions (distinguished by the constant-intensity contourlines). When directed at the target material, these two regions can beused to create multiple laser scribe features.

Another method for generating multiple scribe features in a transparentmaterial employs a diffractive optical element (DOE) that is designed togenerate multiple regions of high optical intensity at differentlocations along the beam propagation axis. FIG. 5 illustrates how such aDOE could function. These multiple intense regions, when directed at thetarget material, generate multiple scribe features for subsequentcleaving of the material.

For a variety of beam-focusing and/or intensity-mapping methods used togenerate multi-scribe ablation features, additional optical componentscould be introduced to generate an elliptical component to the overallbeam shape. By orienting the elliptical beam such that the long axis isparallel to the direction of beam scanning, higher scanning speeds canbe achieved. Higher scanning speeds can be achieved because theelliptical beam shape allows for sufficient pulse-to-pulse overlap forthe machining of smooth and continuous scribe features (as opposed todotted scribe features resulting from spatially-separated pulsesablating the material). While increased pulse overlap, and higherscanning speeds, could also be achieved with a larger circular beamspot, this would at the same time result in a wider scribe featurewidth, which is often undesirable.

2. Ultrashort Pulse Laser Welding

Another embodiment of the current invention relates to a process forlaser-welding of transparent materials. As shown in FIG. 6, thisembodiment requires the use of a laser system (50) producing a beam ofultrashort laser pulses (51) at a high repetition rate; a focusingelement (55) (e.g. lens, microscope objective) of sufficient focusingpower; and at least two materials (56) and (57) to be joined together,at least one of which is transparent to the wavelength of the laser. Inaddition, a beam focus positioning stage (58) is used to adjust thefocus position of the laser beam (51), and an automated motion stageassembly (59) is generally required for moving the work pieces (56) and(57) relative to the focused laser beam.

In this embodiment, the two materials (“top piece” (56) and “bottompiece” (57)) to be laser-welded are placed in contact with each other tocreate an interface with little or no gap between their surfaces; aclamping force may or may not be applied to the two pieces. A lens (55)is then positioned in the path of the laser beam to create a focalregion of high intensity laser radiation. The two transparent materials(56) and (57) are positioned relative to the focused laser beam suchthat the beam focal region spans the interface of the top piece (56) andthe bottom piece (57). With sufficient laser intensity, welding of thematerial interface will occur. By moving the transparent materials (56)and (57) relative to the beam focal region, while at the same timekeeping the interface of the materials (56) and (57) in close proximityto the beam focal region, a determined length of laser welding can beachieved. In a particularly unique application of this embodiment, thematerials (56) and (57) could be positioned such that the focused laserbeam travels through the top (transparent) piece (56) and forms thefocal region near to the interface of the top piece (56) and the bottompiece (57), resulting in welding of the two materials.

Unlike other laser welding processes, the process of the invention weldsby utilizing primarily nonlinear absorption rather than linearabsorption. Because of this, there are unique properties in this weldingprocess. The nonlinear absorption is very intensity dependent so theprocess can be limited to the focus of the laser beam. Thus theabsorption can be made to occur only deep within a transparent materialaround the focus. Typically nonlinear absorption by ultrashort pulsesleads to plasma formation and very little (if any) heat deposition, thusablation with ultrafast lasers leads to a very small heat affected zone(HAZ). However, by keeping the intensity low enough so ablation does notoccur but high enough for nonlinear absorption to occur, some heat isdeposited. If the repetition rate of the laser is increased sufficientlythen the heat can be accumulated sufficiently in the material to lead tomelting.

The laser system (50) emits an approximately collimated laser beam (51)of pulses having a pulse duration in the range of about 200-500 fs and awavelength of about 1045 nm at a pulse repetition rate between 100 kHzand 5 MHz. The first beam steering mirror (52) directs the laser beam tothe power adjust assembly (53), which is used to adjust the pulse energythat is used for the welding process; specific methods for achievingsuch attenuation are well known to those skilled in the art. The secondbeam-steering mirror (54) directs the beam onto the beam focusingobjective (55). The beam focusing objective (55) focuses the laserpulses to achieve the appropriate fluence (energy/unit area) for theprocess, which has a maximal value at approximately a distance (F) fromthe beam focusing objective (55). The beam focus positioning stage (58)translates the beam-focusing objective (55) such that this maximalfluence region is located at the interface of the target materials (56)and (57). The XY stage assembly (59) moves the target materials (56) and(57) relative to the focused beam so as to provide for the ability togenerate a linear weld feature, or an array of circular weld features,at the interface of the target materials (56) and (57).

FIG. 7 shows another embodiment of this invention where welding isdesired between two pieces separated by a small gap (60). First, thelaser beam (51) is focused below the surface of the bottom piece (57).With the proper control of the pulse energy and focusing conditions, araised ridge (61) is formed as the sample is translated relative to thebeam focus (or as the beam is moved relative to the target). This raisedridge (61) bridges the gap between the top and bottom targets. A secondpass of the laser with the beam focus raised to the height near theinterface between the top of the raised ridge (61) and the top piece(56) then forms the weld (62).

3. Visible/Invisible Laser Marks

The same system shown in FIG. 1a can be used to make sub-surface marksin transparent materials where the applied laser beam is focused belowthe surface of the transparent material substrate

FIG. 8 shows an illustration of the top-view of an arrow pattern (63)written in a transparent material (64) such as glass. A light source(65) injects light into an optical waveguide (66) that delivers thelight to the arrow mark (63) to illuminate the pattern. The outputnumerical aperture of the optical waveguide should be properly designedto efficiently illuminate the desired source. Multiple opticalwaveguides can be used to illuminate different regions of a pattern.Controlling the timing of the different illuminating light sources canproduce different decorative and signaling effects. Alternatively, thepattern can be illuminated directly from a properly focused lightsource, rather than using an optical waveguide.

FIG. 9 (a) shows an illustration of a close-up of the top-view of thearrow mark (63) that is made up of parallel lines, all perpendicular tothe direction of the illumination light. These parallel lines aregenerated by tightly focusing the laser light within the targetsubstrate to create regions of material modification. FIG. 9 (b) showsan illustration of the side-view of the arrow mark (63). The arrow markis composed of a group of marks at different depths. These marks scatterthe light delivered by the optical waveguide (66) towards the viewer(67). The brightness can be controlled by the intensity of theilluminating light, the size of the individual marks and the density ofthe marks.

FIG. 10 shows an illustration of the concept where the pattern iscomposed of a “pixels” (68) and where each pixel is made up of a groupof parallel lines at different depths (69) formed by tightly focusingthe laser light to modify the substrate material.

Experimentally Demonstrated Results

1. Ultrashort Pulse Laser Scribing

As shown in FIG. 11, with a single pass of the laser beam, a pair ofscribe lines (a surface groove (70) and a sub-surface scribe feature(71)) were simultaneously machined in a 100-μm thick sapphire waferusing a 20× aspheric focusing objective (8-mm focal length). The cleavefacet exhibits good quality. The scanning speed was 40 mm/s (notoptimized).

For the case of a surface scribe line only, using the same laser pulseenergy and repetition rate, and under identical processing conditions(ambient atmosphere environment, etc.), the fastest scribing speed whichresulted in good cleaving of the material was ˜20 mm/s.

2. Ultrashort Pulse Laser Welding

After a number of laser pulses are absorbed within a particular regionof the materials to be welded, heating, melting and mixing of thematerials occurs and, upon cooling, the separate materials are fusedtogether. The number of pulses required to weld the materials togetherdepends on other process variables (laser energy, pulse repetition rate,focusing geometry, etc.), as well as the physical properties of thematerials. For example, materials with a combination of high thermalconductivity and high melting temperature require higher pulserepetition rates and lower translation speeds to achieve sufficientthermal accumulation within the irradiated volume for welding to occur.

A. Polycarbonate Welding

Experiments with a high-repetition rate, femtosecond pulse laser sourceoperating at a pulse repetition rate of 200 kHz and having a wavelengthof 1045 nm have resulted in the laser-joining of twooptically-transparent materials. In particular, ˜2 μJ laser pulses werefocused with a 100 mm focal length lens through the top surface of a¼″-thick piece of transparent polycarbonate, and onto its bottom surfaceinterface with the top surface of a similarly-sized piece of transparentpolycarbonate. The polycarbonate pieces were translated linearly and ina plane perpendicular to the direction of laser propagation, maintainingpositioning of the beam focal region near-to the interface of thematerials. The two pieces were fused together at the laser-irradiatedinterface and significant force was required to break them free from oneanother.

B. Fused Silica Welding

A 200-μm thick fused silica plate was welded to a 1-mm thick fusedsilica plate using a 40× aspheric lens and a laser repetition rate of 5MHz. The 1/e² beam diameter of the laser was ˜3.6 mm and the asphericlens focal length was 4.5 mm, resulting in an operating NA (numericalaperture) of ˜0.37. FIG. 12 shows a weld feature in fused silica, withimages taken both before and after breaking the two silica plates apart.The first image (a) shows the intact weld feature exhibiting regions ofsmooth melted glass, and the subsequent images (b) and (c) show the twoglass surfaces after the weld was fractured, exhibiting facets offractured glass.

Welding speeds ranged from 0.1 to 1.0 mm/s, though speeds greater than 5mm/s are possible, and the maximum speed could be increased with anincreased pulse repetition rate. The nominal fluence range for theprocess is 5-15 J/cm² and the nominal pulse duration range is 10-1000fs. Within these fluence and pulse duration ranges, the nominal pulserepetition rate range is 1-50 MHz. With rigorous process optimization,these ranges may be extended to 1-100 J/cm², 1 fs-500 ps, and 100kHz-100 MHz for the fluence, pulse duration, and repetition rate,respectively. The high repetition rate is required for sufficientthermal accumulation for the onset of melting in the fused silica.

With the availability of higher energy pulses at similar repetitionrates, looser focusing is possible to generate a larger focal volumewith the required fluence. The size and shape of this welding focalvolume can be tailored based on the region to be welded.

3. Visible/Invisible Laser Marks

FIG. 13 shows a glass sample with the arrow mark illuminated by a greenlight source from the side. Here, the arrow pattern is clearly visible.The illustrations in FIGS. 8 and 9 show the details of the arrowpattern, where lines at different depths, perpendicular to theilluminating light source (green light in this case) were generated bytightly focusing the laser light.

FIG. 14 shows the same glass sample with the illuminating light sourceoff. Clearly, the arrow pattern cannot be seen.

FIG. 15 shows a microscope photo of an individual pixel that is used todefine the arrow mark in FIG. 13. FIG. 16 (a) shows a photo of adecorative pattern inside glass and FIG. 16 (b) shows a microscope imageof an individual mark.

The mark in FIG. 16 (b) is approximately 200 μm in size and very rough,composed of several distinct cracks radiating from the center. The pixelin FIG. 15 is made up of a series of parallel lines, each line isroughly 10 μm wide and 250 μm long. The line spacing is 50 μm. Thedifference in size and smoothness difference between the features inFIGS. 15 and 16 (b) explains why the glass sculpture in FIG. 16 (a) isclearly visible in most lighting conditions while the arrow in FIGS. 13and 14 requires side illumination to be visible. The size and smoothnessof the generated feature is controlled by the pulse energy, pulseduration, wavelength of the laser and the translation speed of the beamthrough the target. The optimal parameters depend on the particulartarget material. The visibility of the pixel in FIG. 15 can becontrolled by controlling the width and length of each line in the pixeland the line density within the pixel as well as the smoothness.

Thus, one method for generating visible patterns of laser-modifiedfeatures below the surface of the transparent material proceeds by firstforming a plurality of lines at different depths within the materialusing a tightly focused ultrafast pulse laser, while controlling theroughness of the lines by controlling parameters of said laser asdescribed. The lines are then illuminated using light propagating ordirected generally perpendicular to the lines. The patterns formed inthis way are clearly visible to the unaided eye when illuminated fromthe perpendicular direction, although they are substantially invisibleto the unaided eye when not illuminated; i.e., under normal ambientlight conditions as in FIG. 14. The illumination is conducted bydirecting a focused light source upon the lines or by directing thelight to the lines via an optical waveguide with an output numericalaperture selected to efficiently illuminate the pattern.

Different ones of said lines, for example the lines of different pixels,can be at defined angles relative to one another, and can be illuminatedseparately or simultaneously by arranging multiple light sources so thatthey each direct light generally perpendicular to a subset of saidlines.

Thus, the invention provides a transparent material having patterns ofsub-surface markings formed by a laser, e.g. an ultrafast pulse laser,where the markings are formed of lines at different depths within thematerial, with the lines being substantially visible to the unaided eyeonly when illuminated with a light source directed generallyperpendicular to the lines.

What is claimed is:
 1. A method of scribing a transparent material,comprising: using a single scan of a focused beam of ultrashort laserpulses to simultaneously create a surface groove in said material and atleast one modified region within the bulk of said material.
 2. A methodfor scribing a transparent material comprising using a single scan of afocused beam of ultrashort laser pulses to simultaneously create aplurality of modification regions within the bulk of said material inits depth direction.
 3. A transparent material scribed at two or morelocations in a depth direction thereof by a single scan of a focusedbeam of ultrashort laser pulses.
 4. The transparent material accordingto claim 3, wherein said two or more locations include a surface of saidmaterial having a groove formed therein.
 5. A system for scribing atransparent material, comprising: an ultrashort laser source to generatea beam of ultrashort pulses; an optical system to focus and deliver saidbeam of ultrashort pulses to said material with optical intensitysufficiently high so as to produce non-linear absorption within saidmaterial and to modify said material so as to produce scribe features;and a motion system operatively connected to said ultrashort source andsaid optical system.
 6. The system according to claim 5, wherein saidscribe features are formed with spatially overlapping ultrashort pulses.